- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/26 - Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances
Patent holdings for IPC class H01L 23/26
Total number of patents in this class: 219
10-year publication summary
|
21
|
23
|
23
|
15
|
16
|
8
|
13
|
5
|
11
|
1
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| SAES Getters S.p.A. | 338 |
15 |
| Raytheon Company | 8535 |
12 |
| Commissariat à l'énergie atomique et aux energies alternatives | 10525 |
11 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
9 |
| Global Circuit Innovations Incorporated | 21 |
9 |
| Robert Bosch GmbH | 40953 |
6 |
| Infineon Technologies AG | 8189 |
6 |
| Monolith Semiconductor, Inc. | 22 |
6 |
| Mitsubishi Electric Corporation | 43934 |
5 |
| Intel Corporation | 45621 |
4 |
| Micron Technology, Inc. | 24960 |
4 |
| Boe Technology Group Co., Ltd. | 35384 |
4 |
| Industry-university Cooperation Foundation Hanyang University Erica Campus | 511 |
4 |
| Johnson Matthey Public Limited Company | 1852 |
4 |
| Tesa SE | 1011 |
4 |
| Qualcomm Mems Technologies, Inc. | 628 |
3 |
| Kyocera Corporation | 12735 |
3 |
| GLOBALFOUNDRIES U.S. Inc. | 6459 |
3 |
| Netlist, Inc. | 119 |
3 |
| Samsung Electronics Co., Ltd. | 131630 |
2 |
| Other owners | 102 |